Standard PCB

A PCB is known as a printed circuit board which mechanically supports and connects electrically with the electronic and electrical components that use conductive tracks, pads and other features. It has one or more sheets of copper laminated layers which are placed between sheets of a non-conductive substrate. The PCB consists of various components mounted and soldered on it, both electrically and mechanically. Their uses are applied on almost every electronic product.

At Accent Die & Fixtures, Standard PCB service refers to full featured printed circuit board manufacturing service. Standard PCB service is generally recommended when the testing phase is complete and the final circuit design is ready for volume production.

Unlike Prototype PCB service, our standard PCBs are manufactured with tighter production tolerances. It covers almost all kinds of substrate materials including CEM1-3 & FR4 with surface finishes like OSP, HASL, Lead free HASL ( only for FR4 ) and ENIG.

We are capable of manufacturing above 10,000 units of high quality PCBs at a very competitive price. We offer advanced features for Standard PCB services.

The design of a standard PCB is show below

Feature Capability
Quality Grade Standard IPC 2
Number of Layers 1 - 32layers
Order Quantity 1pc - 10,000,000 pcs
Build Time 2days - 5weeks (Expedited Service)
Material FR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg 180°C, FR4-Halogen-free, FR4-Halogen-free & High-Tg
Board Size Min 6*6mm | Max 600*700mm
Board size tolerance ±0.1mm - ±0.3mm
Board Thickness 0.4mm - 3.2mm
Board Thickness Tolerance ±0.1mm - ±10%
Copper Weight 0.5oz - 6.0oz
Inner Layer Copper Weight 0.5oz - 2.0oz
Copper Thickness Tolerance +0μm +20μm
Min Tracing/Spacing 3mil/3mil
Solder Mask Sides As per the file
Solder Mask Color Green, White, Blue, Black, Red, Yellow
Silkscreen Sides As per the file
Silkscreen Color White, Blue, Black, Red, Yellow
Surface Finish HASL - Hot Air Solder Leveling
Lead Free HASL - RoHS
ENIG - Electroless Nickle/Immersion Gold - RoHS
ENEPIG - Electroless Nickel Electroless Palladium Immersion Gold - RoHS
Immersion Silver - RoHS
Immersion Tin - RoHS
OSP -Organic Solderability Preservatives - RoHS
Min Annular Ring 3mil
Min Drilling Hole Diameter 6mil, 4mil-laser drill
Min Width of Cutout (NPTH) 0.8mm
NPTH Hole Size Tolerance ±.002" (±0.05mm)
Min Width of Slot Hole (PTH) 0.6mm
PTH Hole Size Tolerance ±.003" (±0.08mm) - ±.006" (±0.15mm)
Surface/Hole Plating Thickness 20μm - 30μm
SM Tolerance (LPI) .003" (0.075mm)
Aspect Ratio 1.10 (hole size: board thickness)
Test 10V - 250V, flying probe or testing fixture
Impedance tolerance ±5% - ±10%
SMD Pitch 0.2mm(8mil)
BGA Pitch 0.2mm(8mil)
Chamfer of Gold Fingers 20, 30, 45, 60
Other Techniques Gold fingers
Blind and Buried Holes
peelable solder mask
Edge plating
Carbon Mask
Kapton tape
Countersink/counterbore hole
Half-cut/Castellated hole
Press fit hole
Via tented/covered with resin
Via plugged/filled with resin
Via in pad
Electrical Test